Reed Smith is at the forefront of thought leadership surrounding 3D printing and how this revolutionary technology will impact our pharmaceutical and medical device clients, as well as universities and other leading medical centers which are incorporating this technology into patient care. Our 3D printing team has authored two white papers (available here and here) on the subject, and we're now pleased to bring you another complimentary CLE webinar on the issue. Reed Smith associate Michael Mandell, along with colleagues from Exponent, will be hosting this event, "3D Printing: Component Parts/Raw Materials Product Liability & Health Risks," on October 5, 2017 at 12 p.m. ET.
The webinar will focus on selective laser sintering, which is among the more widely used 3D Printing/Additive Manufacturing technologies for industrial applications. The medical device industry is currently adopting this technology for the manufacture of patient-specific cranial implants, maxillofacial implants, spinal cages, hip-cup implants, surgical tools and guides, and prosthetics, and more. The use of powder introduces a range of damage risks, not to mention health concerns, that warrant attention for the additive manufacturing of parts, including the source supplier, additive manufacturer, trained personnel of the machine, and the end consumer.
The presenters will discusses the potential liability of suppliers of such powders and their available defenses, as well as the various risks, potential consequences, and plausible sequence of events that can result in injury to nearby workers or those implanted with the final product.
This webinar is presumptively approved for 1.0 general CLE credit in California, Illinois, New Jersey, Pennsylvania, Texas and West Virginia. For lawyers licensed in New York, this course is eligible for 1.0 credit under New York's Approved Jurisdiction Policy. To register for the free webinar, please click here.
This article is presented for informational purposes only and is not intended to constitute legal advice.
